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第4回IEMF次世代モバイルテクノロジー&ソリューション

The IEMF (Inter-Embassy IT & Mobile Forum) "Next Generation Mobile Showcase 2009"

April 16 – 17, 2009 at the Canadian Embassy, Tokyo, Japan

Due to the large and successful participation of overseas exhibitors in the 2008 event, the Inter-Embassies IT & Mobile Forum/ IEMF is pleased to invites you to a two-day wireless seminar and exhibition entitled The IEMF (Inter-Embassy IT & Mobile Forum) "Next Generation Mobile Showcase 2009", which will be held April 16th and 17th, 2009 at the Canadian Embassy in Tokyo. This event will showcase wireless companies from IEMF member countries and provide you with the opportunity to present your technology and products to the membership of the Mobile Computing Promotion Consortium (MCPC), including engineers and decision-makers from Japan’s leading IT and mobile communications companies.

We expect our “Showcase 2009” event to be attended by as many as 2000 buyers, business executives and engineers from all core sub-sectors of the wireless industry in Japan, including the mobile phone carriers (NTT DoCoMo, KDDI-au, Softbank), handset manufacturers (Toshiba, Fujitsu, NEC, Panasonic, Olympus, etc.), and systems integrators (Itochu Techno Science, Marubeni Information Systems, Hitachi Information Systems, etc.). This will be, for overseas suppliers, a rare opportunity to exhibit and present their product or technology directly to so many Japanese industry insiders, as well as to mingle with other foreign exhibitors at the Canadian Embassy Tokyo!

Outline of the event

第3回次世代モバイル会場風景前回の展示会場風景Objectives: To introduce Canadian companies and increase the penetration of Canadian next-generation wireless technology and products into the Japanese market.

Venue: Canadian Embassy, Tokyo/ 7-3-38 Akasaka, Minato-ku, Tokyo

Show Dates: Thursday, April 16th - Friday, 17th from 10:00AM – 5:00PM (Reception: after the show/seminars on Thursday, April 16th)

Program elements:
• Plenary Session (Country-specific keynote speeches) at Theater
• All-day exhibition (booths) at 4F event hall (2m x 2m Exhibition Booth)
• Networking reception (April 17th) at Ambassador`s Residence

Lead Organizer: the Inter-Embassy IT & Mobile Forum and The Canadian Embassy in Tokyo
Co-organizers: Mobile Computing Promotion Consortium (MCPC)

Supported by: Canadian Embassy, Japan External Trade Organization (JETRO) and the IEMF member countries: Embassies of Australia, Finland, Ireland, Luxembourg, United Kingdom, Israel, United States, and South Korea

Number of Exhibitors:45 Number of Buyers:2,000

次世代モバイルテクノロジー&ソリューションKeynote Speech in 2008Photos from last event in 2008LinkIcon


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Participation Fee:
MCPC Members: ¥150,000 (Or US $1600)/ Considering current economic situations, this fee structure has been changed from previously announced amounts.
Standard Participation Fee: ¥220,000 (Or US $2300)/ Considering current economic situations, this fee structure has been changed from previously announced amounts.


30 minutes presentation is available for \30,000/ $310

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For More Information, please contact to:

Mobile Computing Promotion Consortium
TEL:03-5401-1935  FAX: 03-5401-1937 
E-mail:info@iemf.jp

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